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Lead-Free Articles from the Journal of Electronic Materials

By Kelly Roncone Zappas, TMS News Editor
Posted Date: 4/28/2008

The Journal of Electronic Materials (JEM), a publication of TMS and IEEE, regularly publishes papers related to lead-free soldering issues. JEM presents papers detailing critical new developments in the electronics field, as well as invited and contributed review papers on topics of current interest. In the March issue of the journal, a collection of 11 papers are devoted to lead-free solder materials. The following papers are included in the March issue:

"Ambient Temperature Ultrasonic Bonding of Si-Dice Using Sn-3.5wt.%Ag," by Jung-Mo Kim, Jae-Pil Jung, Y. Norman Zhou, and Jong-Young Kim
"Effect of Ag and Cu Concentrations on the Creep Behavior of Sn-Based Solders," by T. Chen and I. Dutta
"Effect of Bi on the Interfacial Reaction between Sn-3.7Ag- x Bi Solders and Cu," by M. He and V.L. Acoff
"Effect of Lanthanum Doping on the Microstructure of Tin-Silver Solder Alloys," by Min Pei and Jianmin Qu
"Energy-Based Micromechanics Analysis on Fatigue Crack Propagation Behavior in Sn-Ag Eutectic Solder," by Yao Yao, Semyon Vaynman, Leon M. Keer, and Morris E. Fine
"Experimental Study of Au-Pt-Sn Phase Equilibria and Thermodynamic Assessment of the Au-Pt and Au-Pt-Sn Systems," by Vincent Grolier and Rainer Schmid-Fetzer
"Fabrication of Strained-Si/Strained-Ge Heterostructures on Insulator," by Leonardo Gomez, Michael Canonico, Meekyung Kim, Pouya Hashemi, and Judy L. Hoyt
"Interfacial Reaction Between Cu Substrates and Zn-Al Base High-Temperature Pb-Free Solders," by Yoshikazu Takaku, Lazuardi Felicia, Ikuo Ohnuma, Ryosuke Kainuma, and Kiyohito Ishida
"Microstructure and Creep Deformation of Sn-Ag-Cu-Bi/Cu Solder Joints," by Min He, Sylvester N. Ekpenuma, and Viola L. Acoff
"Thermodynamic Assessment of Phase Equilibria in the Sn-Ag-Ni System with Key Experimental Verification," by F. Gao, C.P. Wang, X.J. Liu, and K. Ishida
"Void Evolution in Sub-100-Micron Sn-Ag Solder Bumps during Multi-Reflow and Aging and its Effects on Bonding Reliability," by Xiaoqin Lin and Le Luo

JEM subscribers can read each of these papers at no charge by clicking on the links above and logging in to the web site. Those who aren't subscribers can purchase access to individual papers through the links above. TMS members receive discounted subscription rates on the journal.

Pages: 1

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Questions? Contact webmaster@tms.org