Listed below are publications in the field. Please visit the Knowledge Resource Center for a complete listing of proceedings and publications.

New for 2008:
Electronic materials-related proceedings published in the TMS 2008 Annual Meeting Supplemental Proceedings Volume 3: General Paper Selections

TMS makes available presentations from the Annual Lead-Free Solder Workshop. The latest available presentations come from this series are available on the Workshops page of the Knowledge Resource Center.

The following related books are also available:

• A Guide to Lead-Free Solders
• Mechanics of Solder Alloy Interconnects
• Structural Integrity and Reliability in Electronic Materials
• Surface Mount Technology

• Archived webinars
  • Materials Science and Policy for Environmentally Benign Electronics
  • Progress in Lead-Free Solders

JOM: The TMS member journal, JOM, annually focuses matters associated with lead-free solder. Recent editions of note include:

• Commentary: Lead-free solders: Reliability and other issues a year after the legislation, by Srinivas Chada.  July 2007.
• Public health and environmental benefits of adopting lead-free solders by Oladele A. Ogunseitan. July 2007.
• The effects of additives to SnAgCu alloys on microstructure and drop impact reliability of solder joints, by Weiping Liu and Ning-Cheng Lee.  July 2007. 
• Electrical measurement of a lead-free solder assembly after environmental tests by SEM internal probing, by T. I. Shih, Y. C. Lin, J. G. Duh, Tom Hsu and W. S. Wu.  July 2007.
• Observations of nucleation catalysis effects during solidification of SnAgCuX solder joints, by I. E. Anderson, J. Walleser and J. L. Harringa. July 2007.

Journal of Electronic Materials: Lead-free solder is also covered extensively in the monthly TMS archival publication Journal of Electronic Materials. Recent articles of note include:

January 2008:

• Special Issue Featuring Lead-Free Solder Materials

February 2008: (Selected Papers on Lead-Free Solder Materials)

• Secondary Current Crowding Effect during Electromigration of Flip-Chip Solder Joints by J.W. Jang, L.N. Ramanathan, J. Tang and D.R. Frear.  February 2008.
• Deformation Behavior of Sn-3.8Ag-0.7Cu Solder at Intermediate Strain Rates: Effect of Microstructure and Test Conditions, by Xin Long, Indranath Dutta, Vijay Sarihan and Darrel R. Frear.  February 2008.
• Ball Impact Responses of Ni- or Ge-Doped Sn-Ag-Cu Solder Joints by Yi-Shao Lai, Jenn-Ming Song, Hsiao-Chuan Chang and Ying-Ta Chiu.  February 2008.
• Thermodynamic Assessments of the Ag-Ni Binary and Ag-Cu-Ni Ternary Systems, by Xing Jun Liu, Feng Gao, Cui Ping Wang and Kiyohito Ishida.  February 2008.
• Recent Observations on Tin Pest Formation in Solder Alloys, by W.J. Plumbridge.  February 2008.
• Effect of Polyethylene Glycol Additives on Pulse Electroplating of SnAg Solder, by Hsiao-Yun Chen, Chih Chen, Pu-Wei Wu, Jia-Min Shieh, Shing-Song Cheng and Karl Hensen. February 2008.

March 2008: (Selected Papers on Lead-Free Solder Materials)

• Ambient Temperature Ultrasonic Bonding of Si-Dice Using Sn-3.5wt.%Ag, by Jung-Mo Kim, Jae-Pil Jung, Y. Norman Zhou and Jong-Young Kim. March 2008.
• Effect of Ag and Cu Concentrations on the Creep Behavior of Sn-Based Solders, by T. Chen and I. Dutta. March 2008.
• Effect of Bi on the Interfacial Reaction between Sn-3.7Ag- x Bi Solders and Cu, by M. He and V.L. Acoff. March 2008.
• Effect of Lanthanum Doping on the Microstructure of Tin-Silver Solder Alloys, byMin Pei and Jianmin Qu. March 2008.
• Energy-Based Micromechanics Analysis on Fatigue Crack Propagation Behavior in Sn-Ag Eutectic Solder, by Yao Yao, Semyon Vaynman, Leon M. Keer and Morris E. Fine. March 2008.
• Experimental Study of Au-Pt-Sn Phase Equilibria and Thermodynamic Assessment of the Au-Pt and Au-Pt-Sn Systems, by Vincent Grolier and Rainer Schmid-Fetzer. March 2008.
• Fabrication of Strained-Si/Strained-Ge Heterostructures on Insulator, by Leonardo Gomez, Michael Canonico, Meekyung Kim, Pouya Hashemi and Judy L. Hoyt. March 2008.
• Interfacial Reaction Between Cu Substrates and Zn-Al Base High-Temperature Pb-Free Solders, by Yoshikazu Takaku, Lazuardi Felicia, Ikuo Ohnuma, Ryosuke Kainuma and Kiyohito Ishida. March 2008.
• Microstructure and Creep Deformation of Sn-Ag-Cu-Bi/Cu Solder Joints, by Min He, Sylvester N. Ekpenuma and Viola L. Acoff. March 2008.
• Thermodynamic Assessment of Phase Equilibria in the Sn-Ag-Ni System with Key Experimental Verification, by F. Gao, C.P. Wang, X.J. Liu and K. Ishida. March 2008.
• Void Evolution in Sub-100-Micron Sn-Ag Solder Bumps during Multi-reflow and Aging and its Effects on Bonding Reliability, by Xiaoqin Lin and Le Luo. March 2008.