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NPL Develops New Solder Appraisal Approach

Posted Date: 7/2/2008
The United Kingdom’s National Physical Laboratory (NPL) has designed and built a new instrument for testing low cycle isothermal fatigue of lead-free ... [READ MORE]

iNEMI Initiates Pb-Free Component and Board Finish Reliability Project

Posted Date: 6/27/2008
A new project evaluating the effects of alternative surface finishes for circuit boards and package substrates on lead-free solder joint reliability d... [READ MORE]

New Database for RoHS Compliance Launched

Posted Date: 6/24/2008
A new web database launched on June 4 enables suppliers to upload their substances declarations required by the Restriction of Hazardous Substances (R... [READ MORE]

TMS Issues Call for Papers for Symposium on Pb-Free Solders

Posted Date: 6/18/2008
The Minerals, Metals and Materials Society (TMS) has issued a call for papers for a symposium titled, “Pb-Free Solders and Emerging Interconnect and P... [READ MORE]

Updates Available on NASA-DoD Pb-Free Electronics Project

Posted Date: 6/13/2008
Responding to concerns about how lead-free electronics will perform in high-reliability aerospace applications, NASA launched a multi-year initiative,... [READ MORE]

JOM Seeking Papers on Lead-Free Soldering

Posted Date: 6/10/2008
JOM, the monthly technical journal of the The Minerals, Metals & Materials Society (TMS), is seeking papers on lead-free soldering and reliabil... [READ MORE]

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MODERATOR'S CHOICE:
TOP DIGITAL RESOURCES

Getting the Lead out of Solders
A compilation of web resources introducing the basics leading to the transition to lead-free solders, including the use of lead, concerns over lead-bearing materials and links to governmental legislations

A TMS Knowledge Packet on the Physical Metallurgy of Solders and Solder Interfaces
A compilation of key resources including fundamentals form Solder Mechanics – State of the Art Assessment , JOM articles, presentations from the TMS Annual Meeting and useful weblinks.

A TMS Knowledge Packet on Thermomechanical Fatigue of Solders
A compilation of key resources including fundamentals form Solder Mechanics – State of the Art Assessment , JOM articles, presentations from the TMS Annual Meeting and useful weblinks.

State of Art Lead-Free Solder Technology Workshop
2007 TMS Workshop slides, including audio, covering results and challenges fro the implementation of lead-free solders

Performance Considerations in Lead-Free Solder Implementation
A webcast focusing on issues impacting the effective implementation of lead-free solders, ranging from the development of new solder alloys to the commercial use of lead-free solders.

Phase Transformation and Microstructural Evolution in Solder Joints
This article reviews the phases and microstructures of solder joints critical to their properties, including phase transformation and microstructural evolution in solder joints.

Phase Diagrams and Computational Thermodynamics:Solder Systems
The thermodynamic descriptions of new lead-free solders systems are compiled in database files which can be downloaded.

Review and Analysis of Lead-Free Solder Material Properties
This report provides a quantitative review of the thermo-mechanical properties of lead-free solders, with emphasis on Sn-Ag-Cu (SAC) and Sn-Ag alloys.

Database for Properties of Lead Free Solder Alloys (1.0)
The focus of this database is on physical and mechanical properties of solders and solders joints of lead-free solders.

NIST Recommended Practice Guide: Test Procedures for Developing Solder Data
This publication documents a wide variety of standardized test procedures that can produce valid and reproducible mechanical property data for lead-free solders.

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