MT@TMS: Lead-Free Solder Spotlight Article

	TMS ONLINE \| WEBMASTER \| STAFF CONTACTS
	Lead-Free Solders Community: Front Page

REGISTER TO USE OUR SITE :: JOIN TMS FOR MAXIMUM ACCESS :: LOG IN

OUR COMMUNITIES

MT @ TMS HOME
- - - - - - - - - - - - -

EDUCATION
- - - - - - - - - - - - -

INTEGRATED COMPUTATIONAL MATERIALS ENGINEERING
- - - - - - - - - - - - -

LEAD-FREE SOLDERS
- - - - - - - - - - - - -

MAGNESIUM
- - - - - - - - - - - - -

MATERIALS FOR NUCLEAR POWER
- - - - - - - - - - - - -

SUPERALLOYS
- - - - - - - - - - - - -

USER TOOLS

SUBMIT A RESOURCE
- - - - - - - - - - - - -

JOIN A DISCUSSION
- - - - - - - - - - - - -

VIEW USER PROFILE
- - - - - - - - - - - - -

LINK TO OUR SITE
- - - - - - - - - - - - -

OTHER TMS RESOURCES

TMS MEMBERS-ONLY AREA
- - - - - - - - - - - - -

KNOWLEDGE RESOURCE CENTER
- - - - - - - - - - - - -

CMS-PLUS
- - - - - - - - - - - - -

ADMINISTRATION@TMS
- - - - - - - - - - - - -

GLOBAL MEETINGS CALENDAR
- - - - - - - - - - - - -

TMS ONLINE HOME
- - - - - - - - - - - - -

SPOTLIGHT

NEWS

ARCHIVE

ABOUT

Tin Whisker Resources from Materials Technology@TMS

By Kelly Roncone Zappas, TMS News Editor
Posted Date: 7/3/2008

Harmful lead may be gone from electronic solders, but pesky tin whiskers are still causing problems in many lead-free applications. Tin whiskers are the spontaneous formation of tin filaments that form from very thin surface coatings applied to films for solderability reasons. After some time, these whiskers can cause defects to form, according to Carol A. Handwerker of Purdue University. Handwerker gave the presentation "Fundamentals of Tin Whisker Formation" as part of the TMS webinar, Progress in Lead-Free Solders recorded last fall. This is one of many resources available through the Digital Resource Center of this Lead-Free Solders community. Below is a look at some additional resources on the subject of tin whiskers and links to further information.

NASA Tin Whisker (and Other Metal Whisker) Homepage
This web site from NASA Goddard Space Flight Center provides a collection of papers, a photo gallery, and a video gallery that describe and demonstrate the growth and development of tin whiskers. Last month, the site was updated to include a presentation on the microstructural analysis of whisker growth on SAC solder joints and scanning electron microscopy images of a 27-year old sample containing tin whiskers.

At the end of 2007, the site expanded to include a new series of videos that provides preliminary guidance to illustrate the complexities associated with optical inspection of hardware for metal whiskers. Emphasis has been placed on importance of lighting source, angle of incidence and angle of inspection. The techniques illustrated are not guaranteed to find all whiskers in all situations; rather they are provided in hopes of improving the probability of detection when only optical inspection techniques are available. Both tin and zinc whisker specimens are included. Additional videos are under development to highlight various aspects of inspection for metal whiskers.

Progress in Lead-Free Solders
This 2007 TMS webinar, referenced in the introduction, consists of three presentations: "Fundamentals of Tin Whisker Formation," "Industry Issues on Lead-Free Soldering," and "Lead-Free Package-on-Package (PoP) for 3D Assembly." Free previews are available for each presentation.

iNEMI Tin Whisker Activities
Here, the International Electronic Manufacturing Initiative (iNEMI) reports on results of tin whisker studies undertaken by the organization as well as updates on projects currently under development. In 2007, iNEMI entered the second phase of its tin whisker project, which is continuing to develop tests that will accelerate whisker growth, using theories formulated by previous iNEMI projects to explain the formation of tin whiskers.

Tin Whiskers: Truths and Myths
This presentation from the 2006 TMS Lead-Free Solder Technology Workshop reviews the relevance of tin whiskers to lead-free solders. Topics covered include observation, driving force, models, and mitigation. TMS members can access this resource for free by logging in to this site.

Tin Whisker Session Summary
In the Discussion Board section of this site, poster Jason Walleser summarizes the Tin Whisker Session held at the TMS 2007 Annual Meeting and includes a list of recommended reading on the topic. Read the list and post reading lists of your own through the Discussion Board.

Find these and additional resources on tin whiskers and other physical metallurgy and alloy development issues through the Digital Resource Center of this site.

Pages: 1

COMMUNITY CENTERS

MODERATOR'S CHOICE:
TOP DIGITAL RESOURCES

Getting the Lead out of Solders
A compilation of web resources introducing the basics leading to the transition to lead-free solders, including the use of lead, concerns over lead-bearing materials and links to governmental legislations

A TMS Knowledge Packet on the Physical Metallurgy of Solders and Solder Interfaces
A compilation of key resources including fundamentals form Solder Mechanics – State of the Art Assessment , JOM articles, presentations from the TMS Annual Meeting and useful weblinks.

A TMS Knowledge Packet on Thermomechanical Fatigue of Solders
A compilation of key resources including fundamentals form Solder Mechanics – State of the Art Assessment , JOM articles, presentations from the TMS Annual Meeting and useful weblinks.

State of Art Lead-Free Solder Technology Workshop
2007 TMS Workshop slides, including audio, covering results and challenges fro the implementation of lead-free solders

Performance Considerations in Lead-Free Solder Implementation
A webcast focusing on issues impacting the effective implementation of lead-free solders, ranging from the development of new solder alloys to the commercial use of lead-free solders.

Phase Transformation and Microstructural Evolution in Solder Joints
This article reviews the phases and microstructures of solder joints critical to their properties, including phase transformation and microstructural evolution in solder joints.

Phase Diagrams and Computational Thermodynamics:Solder Systems
The thermodynamic descriptions of new lead-free solders systems are compiled in database files which can be downloaded.

Review and Analysis of Lead-Free Solder Material Properties
This report provides a quantitative review of the thermo-mechanical properties of lead-free solders, with emphasis on Sn-Ag-Cu (SAC) and Sn-Ag alloys.

Database for Properties of Lead Free Solder Alloys (1.0)
The focus of this database is on physical and mechanical properties of solders and solders joints of lead-free solders.

NIST Recommended Practice Guide: Test Procedures for Developing Solder Data
This publication documents a wide variety of standardized test procedures that can produce valid and reproducible mechanical property data for lead-free solders.

Questions? Contact webmaster@tms.org