The articles below originally appeared as spotlight articles within this community, and are ordered chronologically by date as a reference.
| Tin Whisker Resources from Materials Technology@TMS |
By Kelly Roncone Zappas, TMS News Editor
Posted Date: 7/3/2008
Harmful lead may be gone from electronic solders, but pesky tin whiskers are still causing problems in many lead-free applications. Tin whiskers are the spontaneous formation of tin filaments that form from very thin surface coatings applied to films for solderability reasons. After some time, these whiskers can cause defects to form, according to Carol A. Handwerker of Purdue University. Handwerker gave the presentation "Fundamentals of Tin Whisker Formation" as part of the TMS webinar, Progress in Lead-Free Solders recorded last fall. This is one of many resources available through the Digital Resource Center of this Lead-Free Solders community. Below is a look at some additional resources on the subject of tin whiskers and links to further information.
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| Lead-Free and Lead-Bearing Electronic Solders: Implementation, Reliability, and New Technology |
By C. Robert Kao, Department of Materials Science and Engineering, National Taiwan University
Posted Date: 6/3/2008
The following article is from the June issue of JOM and introduces a series of papers presented in the journal by the Electronic Packaging and Interconnection Materials Committee of the TMS Electronic, Magnetic & Photonic Materials Division.
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| Lead-Free Articles from the Journal of Electronic Materials |
By Kelly Roncone Zappas, TMS News Editor
Posted Date: 4/28/2008
The Journal of Electronic Materials (JEM), a publication of TMS and IEEE, regularly publishes papers related to lead-free soldering issues. JEM presents papers detailing critical new developments in the electronics field, as well as invited and contributed review papers on topics of current interest. In the March issue of the journal, a collection of 11 papers are devoted to lead-free solder materials. The following papers are included in the March issue:
- "Ambient Temperature Ultrasonic Bonding of Si-Dice Using Sn-3.5wt.%Ag," by Jung-Mo Kim, Jae-Pil Jung, Y. Norman Zhou, and Jong-Young Kim
- "Effect of Ag and Cu Concentrations on the Creep Behavior of Sn-Based Solders," by T. Chen and I. Dutta
- "Effect of Bi on the Interfacial Reaction between Sn-3.7Ag- x Bi Solders and Cu," by M. He and V.L. Acoff
- "Effect of Lanthanum Doping on the Microstructure of Tin-Silver Solder Alloys," by Min Pei and Jianmin Qu
- "Energy-Based Micromechanics Analysis on Fatigue Crack Propagation Behavior in Sn-Ag Eutectic Solder," by Yao Yao, Semyon Vaynman, Leon M. Keer, and Morris E. Fine
- "Experimental Study of Au-Pt-Sn Phase Equilibria and Thermodynamic Assessment of the Au-Pt and Au-Pt-Sn Systems," by Vincent Grolier and Rainer Schmid-Fetzer
- "Fabrication of Strained-Si/Strained-Ge Heterostructures on Insulator," by Leonardo Gomez, Michael Canonico, Meekyung Kim, Pouya Hashemi, and Judy L. Hoyt
- "Interfacial Reaction Between Cu Substrates and Zn-Al Base High-Temperature Pb-Free Solders," by Yoshikazu Takaku, Lazuardi Felicia, Ikuo Ohnuma, Ryosuke Kainuma, and Kiyohito Ishida
- "Microstructure and Creep Deformation of Sn-Ag-Cu-Bi/Cu Solder Joints," by Min He, Sylvester N. Ekpenuma, and Viola L. Acoff
- "Thermodynamic Assessment of Phase Equilibria in the Sn-Ag-Ni System with Key Experimental Verification," by F. Gao, C.P. Wang, X.J. Liu, and K. Ishida
- "Void Evolution in Sub-100-Micron Sn-Ag Solder Bumps during Multi-Reflow and Aging and its Effects on Bonding Reliability," by Xiaoqin Lin and Le Luo
JEM subscribers can read each of these papers at no charge by clicking on the links above and logging in to the web site. Those who aren't subscribers can purchase access to individual papers through the links above. TMS members receive discounted subscription rates on the journal.
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| The Fourth Element: SnAgCuX Research at Ames Laboratory |
An Interview with Iver Anderson, Ames Laboratory and Iowa State University
Posted Date: 2/13/2008
In the July 2007 issue of JOM, Iver Anderson, senior metallurgist at the U.S. Department of Energy's Ames Laboratory and adjunct professor at Iowa State University; Jason Walleser, a graduate student at Iowa State; and J.L. Harringa of Ames Laboratory published the article, "Observations of Nucleation Catalysis Effects during Solidification of SnAgCuX Solder Joints." Here, Anderson describes the progress made on this work since the article's publication and possible future directions for research on Sn-Ag-Cu (SAC) solders.
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COMMUNITY CENTERS
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MODERATOR'S CHOICE:
TOP DIGITAL RESOURCES
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Getting the Lead out of Solders
A compilation of web resources introducing the basics leading to the transition to lead-free solders, including the use of lead, concerns over lead-bearing materials and links to governmental legislations
A TMS Knowledge Packet on the Physical Metallurgy of Solders and Solder Interfaces
A compilation of key resources including fundamentals form Solder Mechanics – State of the Art Assessment , JOM articles, presentations from the TMS Annual Meeting and useful weblinks.
A TMS Knowledge Packet on Thermomechanical Fatigue of Solders
A compilation of key resources including fundamentals form Solder Mechanics – State of the Art Assessment , JOM articles, presentations from the TMS Annual Meeting and useful weblinks.
State of Art Lead-Free Solder Technology Workshop
2007 TMS Workshop slides, including audio, covering results and challenges fro the implementation of lead-free solders
Performance Considerations in Lead-Free Solder Implementation
A webcast focusing on issues impacting the effective implementation of lead-free solders, ranging from the development of new solder alloys to the commercial use of lead-free solders.
Phase Transformation and Microstructural Evolution in Solder Joints
This article reviews the phases and microstructures of solder joints critical to their properties, including phase transformation and microstructural evolution in solder joints.
Phase Diagrams and Computational Thermodynamics:Solder Systems
The thermodynamic descriptions of new lead-free solders systems are compiled in database files which can be downloaded.
Review and Analysis of Lead-Free Solder Material Properties
This report provides a quantitative review of the thermo-mechanical properties of lead-free solders, with emphasis on Sn-Ag-Cu (SAC) and Sn-Ag alloys.
Database for Properties of Lead Free Solder Alloys (1.0)
The focus of this database is on physical and mechanical properties of solders and solders joints of lead-free solders.
NIST Recommended Practice Guide: Test Procedures for Developing Solder Data
This publication documents a wide variety of standardized test procedures that can produce valid and reproducible mechanical property data for lead-free solders.
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