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SPOTLIGHT

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ADVISORY GROUP

These subject matter experts provide oversight and guide the development of resources and content for the lead-free solder section of Materials Technology@TMS.

• Srinivas Chada
Medtronic
• Nikhilesh Chawla
Arizona State University
• Iver Anderson
Iowa State University
• Alton D. Romig
Sandia National Laboratories
• Darrel Frear
Freescale Semiconductor
• David Hillman
Rockwell Collins
• Carol Handwerker
Purdue University
• Mark Palmer
Kettering University

Materials Technology@TMS: Lead-Free Solders
This site is a first stop for technical resources, discussion, and news related to lead-free solder technology. Links to databases, PowerPoint presentations, publications, conferences, and workshops on lead-free solder technology, as recommended by experts in this field, have been collected here.

This community is supported by the Electronic Packaging and Interconnection Materials Committee. Please visit the Electronic Packaging and Interconnection Materials Committee home page for more information, including conference programming and JOM features.

The initial content for the lead-free solders community was assembled by a panel of experts in the field (see the sidebar for details), but the site will be sustained by contributions from members of the international materials community-professionals like you. Visitors are invited to guide the future direction of this site by submitting resources, participating in the discussion boards, and providing user reviews for resources on the site. A thorough introduction to the community is available in the article "Lead-Free Solders Community on Materials Technology@TMS" by Todd Osman, Materials Technology@TMS Moderators.

The majority of the content on the Technology@TMS web sites can be viewed by all visitors, but only registered users may post comments and other resources. (Creating a registration is free.) Only TMS members have unrestricted access to download resources contained in the digital resource center. TMS members do not need to create a separate registration, but may log in as members to fully access the site's resources.

COMMUNITY CENTERS

MODERATOR'S CHOICE:
TOP DIGITAL RESOURCES

Getting the Lead out of Solders
A compilation of web resources introducing the basics leading to the transition to lead-free solders, including the use of lead, concerns over lead-bearing materials and links to governmental legislations

A TMS Knowledge Packet on the Physical Metallurgy of Solders and Solder Interfaces
A compilation of key resources including fundamentals form Solder Mechanics – State of the Art Assessment , JOM articles, presentations from the TMS Annual Meeting and useful weblinks.

A TMS Knowledge Packet on Thermomechanical Fatigue of Solders
A compilation of key resources including fundamentals form Solder Mechanics – State of the Art Assessment , JOM articles, presentations from the TMS Annual Meeting and useful weblinks.

State of Art Lead-Free Solder Technology Workshop
2007 TMS Workshop slides, including audio, covering results and challenges fro the implementation of lead-free solders

Performance Considerations in Lead-Free Solder Implementation
A webcast focusing on issues impacting the effective implementation of lead-free solders, ranging from the development of new solder alloys to the commercial use of lead-free solders.

Phase Transformation and Microstructural Evolution in Solder Joints
This article reviews the phases and microstructures of solder joints critical to their properties, including phase transformation and microstructural evolution in solder joints.

Phase Diagrams and Computational Thermodynamics:Solder Systems
The thermodynamic descriptions of new lead-free solders systems are compiled in database files which can be downloaded.

Review and Analysis of Lead-Free Solder Material Properties
This report provides a quantitative review of the thermo-mechanical properties of lead-free solders, with emphasis on Sn-Ag-Cu (SAC) and Sn-Ag alloys.

Database for Properties of Lead Free Solder Alloys (1.0)
The focus of this database is on physical and mechanical properties of solders and solders joints of lead-free solders.

NIST Recommended Practice Guide: Test Procedures for Developing Solder Data
This publication documents a wide variety of standardized test procedures that can produce valid and reproducible mechanical property data for lead-free solders.

Questions? Contact webmaster@tms.org