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EMC 2009 Examines Current and Future Trends in Electronic Materials
By Lynne Robinson
TMS
Posted on: 6/3/2009 12:00:00 AM... From computers that switch on instantly like a light bulb, to devices the size of a quarter that contain the contents of 250 DVDs, the future of electronics depends on the materials that make them.

For more than 50 years, the TMS Electronic Materials Conference (EMC) has “served as a unique venue to present recent results on novel electronic materials and devices for the international community,” said Robert Biefeld, general chair of EMC 2009. This year’s event will take place from June 24-26 at the Pennsylvania State University.

The EMC is sponsored by the TMS Electronic Materials Committee, which is dedicated to the dissemination of the latest scientific and engineering knowledge in electronic materials. As one of the committee’s key initiatives, the EMC is designed to address both current and future trends impacting electronic materials and the associated materials sciences. “As new materials and devices are discovered, we look at a broad overview of the community and try to stay on the cutting edge of electronic material and device development,” said Biefeld.

EMC 2009 offers a number of sessions in the “Issues for Wide Bandgap Materials” and “Nanoscale Science and Technology in Materials” programming areas. Additional topics being explored at the conference include:

  • Contacts to Semiconductor Epilayers, Nanowires, Nanotubes, and Organic Films
  • Epitaxy
  • Epitaxial Materials and Devices
  • Epitaxy: Configurable 3D, Metamorphic, and Template Growth
  • Point and Extended Defects in Mismatched Materials
  • Nondestructive Testing and In Situ Monitoring and Control
  • Semiconductor Processing: Oxidation, Passivation, Functionalization, and Etching
  • Materials Integration: Wafer Bonding and Engineered Substrates
  • Oxide Thin Film Integration: Alternative Dielectrics, Epitaxial Oxides, Superlattices, and Metal Gates
  • Si-Based Heterojunctions
  • Narrow Bandgap Semiconductors: Antimonides and Other Materials
  • Indium Nitride: Growth, Processing, Characterization, Theory, and Devices
  • Spin-Dependent (or Spintronic) Electronic Materials
  • Dilute Nitride Semiconductors
  • Flexible and Printed Thin Film Electronics
  • Organic Thin Film and Crystalline Transistors: Devices, Materials, and Processing
  • Organic-Inorganic Hybrid Photovoltaics
  • Materials and Novel Concepts for UV Detectors and Emitters
Offering a glimpse of the future of electronic materials are several topics relatively new to the EMC, including, “Ionic Conductors for Transport and Energy Applications,” “Compound Semiconductor Growth on Si Substrates,” “Solar Cell Materials and Devices,” “Graphene (and Carbon Nanotubes),” and “Thermoelectrics and Thermionics.” Biefeld said that issues such as high-power, high-temperature, and high-speed devices, as well as terahertz, far ultraviolet, and other exploration into new parts of the spectrum, may impact on the content of future EMCs."

Registration information and a preliminary copy of the 2009 Electronic Materials Conference technical program can be accessed at this link.

Lynne Robinson is the news and feature writer for Materials Technology@TMS.


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